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1

Impact of joint materials on the reliability of double-side packaged SiC power devices during high temperature aging

Fengqun Lang, Hiroshi Nakagawa, Masahiro Aoyagi, Hiromichi Ohashi, Hiroshi Yamaguchi

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2010

Language:

english

File:

PDF, 1.10 MB

english, 2010

2

A Novel Three-Dimensional Packaging Method for Al-Metalized SiC Power Devices

Fengqun Lang, Hayashi, Y., Nakagawa, H., Aoyagi, M., Ohashi, H.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 2.31 MB

english, 2009

3

Soldering of non-wettable Al electrode using Au-based solder

Lang, Fengqun, Nakagawa, Hiroshi, Yamaguchi, Hiroshi

Journal:

Year:

2014

Language:

english

File:

PDF, 1.85 MB

english, 2014

4

Cyclic Thermal Stress-Induced Degradation of Cu Metallization on Si3N4 Substrate at −40°C to 300°C

Lang, Fengqun, Yamaguchi, Hiroshi, Nakagawa, Hiroshi, Sato, Hiroshi

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 1.71 MB

english, 2015

5

Early fungicide treatment reduces blackleg on canola but yield benefit is realized only on susceptible cultivars under high disease pressure

Peng, Gary, Liu, Chang, Fernando, Dilantha W.G., Lang, Ralph, Mclaren, Debra L., Johnson, Eric N., Kutcher, H. Randy, Singh, Gursahib, Turkington, T. Kelly, Yu, Fengqun

Journal:

Canadian Journal of Plant Pathology

Year:

2020

File:

PDF, 2.27 MB

2020

6

The corrosion resistance and wear resistance of thick TiN coatings deposited by arc ion plating

Fengqun Lang, Zhiming Yu

Journal:

Surface and Coatings Technology

Year:

2001

Language:

english

File:

PDF, 1.56 MB

english, 2001

7

Oxidation Behavior of Nickel-Base Single-Crystal Superalloy with Rhenium-Base Diffusion Barrier Coating System at 1,423

Toshio Narita, Fengqun Lang, Kemas Zaini Thosin, Takayuki Yoshioka, Takeshi Izumi, Hiroshi Yakuwa, Shigenari Hayashi

Journal:

Oxidation of Metals

Year:

2007

Language:

english

File:

PDF, 1.41 MB

english, 2007

8

Improvement in Joint Reliability of SiC Power Devices by a Diffusion Barrier Between Au-Ge Solder and Cu/Ni(P)-Metalized Ceramic Substrates

Fengqun Lang, Hiroshi Yamaguchi, Hiromichi Ohashi, Hiroshi Sato

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 717 KB

english, 2011

9

The effect of strain rate and temperature on the tensile properties of Sn–3.5Ag solder

Fengqun Lang, Hiroyuki Tanaka, Osamu Munegata, Toshihiko Taguchi, Toshio Narita

Journal:

Materials Characterization

Year:

2005

Language:

english

File:

PDF, 507 KB

english, 2005

10

Cyclic oxidation behavior of Fe-40Al sheet

Fengqun Lang, Zhiming Yu, Shalva Gedevanishvili, Seetharama C. Deevi, Toshio Narita

Journal:

Year:

2004

Language:

english

File:

PDF, 917 KB

english, 2004

11

Sulfidation behavior of Fe–40Al sheet in H2–H2S mixtures at high temperatures

Fengqun Lang, Zhiming Yu, Shalva Gedevanishvili, Seetharama C. Deevi, Shigenari Hayashi, Toshio Narita

Journal:

Year:

2004

Language:

english

File:

PDF, 610 KB

english, 2004

12

Improvement in oxidation resistance of a Ni3Al-based superalloy IC6 by rhenium-based diffusion barrier coatings

Fengqun Lang, Toshio Narita

Journal:

Year:

2007

Language:

english

File:

PDF, 803 KB

english, 2007

13

Corrosion behavior of Fe-40Al sheet in N2–11.2O2–7.5CO2 atmospheres with various SO2 contents at 1273 K

Fengqun Lang, Zhiming Yu, Shalva Gedevanishvili, Seetharama C Deevi, Shigenari Hayashi, Toshio Narita

Journal:

Year:

2003

Language:

english

File:

PDF, 634 KB

english, 2003

14

Effect of pre-oxidation on the corrosion behavior of Fe–40Al sheet in a N2–11.2O2–7.5CO2–500 ppm SO2 atmosphere at 1273 K

Fengqun Lang, Zhiming Yu, Shalva Gedevanishvili, Seetharama C Deevi, Toshio Narita

Journal:

Year:

2003

Language:

english

File:

PDF, 684 KB

english, 2003

15

Isothermal oxidation behavior of a sheet alloy of Fe–40at.%Al at temperatures between 1073 and 1473 K

Fengqun Lang, Zhiming Yu, Shalva Gedevanishvili, Seetharama C. Deevi, Toshio Narita

Journal:

Year:

2003

Language:

english

File:

PDF, 654 KB

english, 2003

16

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - A novel chip joint method for high temperature operated SiC power modules

Lang, Fengqun, Hayashi, Yusuke, Nakagawa, Hiroshi, Aoyagi, Masahiro, Ohashi, Hiromichi

Year:

2006

Language:

english

File:

PDF, 583 KB

english, 2006

17

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Effect of solder diffusion barriers on the joint reliability of SiC power devices operated above 300°C

Lang, Fengqun, Oohashi, Hiromichi, Yamaguchi, Hiroshi

Year:

2010

Language:

english

File:

PDF, 1.46 MB

english, 2010

18

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - High temperature resistant joint technology for SiC power devices using transient liquid phase sintering process

Lang, Fengqun, Yamaguchi, Hiroshi, Nakagawa, Hiroshi, Sato, Hiroshi

Year:

2012

Language:

english

File:

PDF, 1.67 MB

english, 2012

19

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Joint Reliability of Double-Side Packaged SiC Power Devices to a DBC Substrate with High Temperature Solders

Lang, Fengqun, Hayashi, Yusuke, Nakagawa, Hiroshi, Aoyagi, Masahiro, Ohashi, Hiromichi

Year:

2008

Language:

english

File:

PDF, 5.60 MB

english, 2008

20

[IEEE 2013 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Nara, Japan (2013.12.12-2013.12.15)] 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) - Development of SiC power module for high-speed switching operation

Sato, Hiroshi, Kato, Fumiki, Nakagawa, Hiroshi, Yamaguchi, Hiroshi, Rejeki, Simanjorang, Lang, Fengqun

Year:

2013

Language:

english

File:

PDF, 910 KB

english, 2013

21

Deformation and Oxidation of Copper Metallization on Ceramic Substrate During Thermal Cycling From −40 °C to 250 °C

Fengqun Lang, H. Yamaguchi, H. Nakagawa, H. Sato

Year:

2015

Language:

english

File:

PDF, 2.93 MB

english, 2015

22

250 °C-Operated sandwich-structured all-SiC power module

Kato, Fumiki, Simanjorang, Rejeki, Lang, Fengqun, Nakagawa, Hiroshi, Yamaguchi, Hiroshi, Sato, Hiroshi

Journal:

Japanese Journal of Applied Physics

Year:

2015

Language:

english

File:

PDF, 1.37 MB

english, 2015

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